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technology Platforms
3DGS offers various technology platforms and process flows to enable customers to implement their designs in an efficient and cost effective manner
Integrated Passive Devices (IPD)
Embedding high quality passives like resistors, inductors and capacitors in the glass substrate enables customers to build filters, diplexers and couplers etc. that are not only miniaturized but also retain high performance. These glass chips can be mounted directly on a PCB.
Custom Fabrication
3DGS offers unique technology to build miniaturized waveguides, high gain antennas, cavities etc. in glass core substrates. These can be used to build high frequency filters, very low loss transmission lines, sensors, high performance AiP etc.
RF Substrates
Combine the benefits of advanced packaging with our integrated passive components and standard off the shelf components to produce complex RF/Analog Systems-in-Package. compatible with SMT, wire bonding, and flip chip assembly processes.
Digital Substrates
3DGS technology enables advanced substrates required for chiplet integration by offering fine line width and spacing and high number of RDL layers.
Glass Substrate Stacking (3DHI)
Realize substantial SWAP-C benefits by Stacking multiples substrate layers in the Z dimension for complex systems. 3DGS has demonstrated compelling value proposition with our 3D Heterogeneous Integration (3DHI) approach