Since their emergence in the 1970s, glass ceramics have conventionally been used for stovetops, cookware, and industrial aerospace applications. But, thinking outside the box, a young researcher at Sandia National Labs invented a technique that leveraged the unique properties of glass ceramics and an innovative manufacturing process to create precise, 3D RF passive components for the electronics industry. Such was the beginning of 3D Glass Solutions, Inc. (3DGS), founded by Jeb Flemming in 2005.

Established as a 3D microstructural parts manufacturer, 3DGS utilizes semiconductor lithography techniques to pattern areas of substrates to become ceramic while other areas remain glass. The ceramic areas are chemically wet etched in diluted acids to create 3D microstructures within the substrate, while the glass area remains intact.

Inherently flexible and applicable across a wide range of end uses, 3DGS’ technology overcomes the challenges of conventional approaches to device design and offers higher-performance for radio frequency (RF) microwave and millimeter-wave (mmWave) applications. We introduced 3DHI (3 Dimensional Heterogeneous Integration) solution by stacking multiple layers of glass to provide significant SwaP-C benefit to RF subsystems. We are also offering solutions for Photonics, Sensor and HPC market segments.

Now in its second decade of successful operation, 3DGS is a nimble, entrepreneurial-minded organization led by seasoned technology experts and business pros. Attractive to young engineering talent, 3DGS’ dynamic environment, strategic location and impactful technology is drawing new, energetic, and creative technologists to its team.