Home / Design Enablement
Design Enablement
Abstracting the process technology and flows with PDK and ADK allows customers to use industry standard EDA tools to design complex substrates and advanced packages with ease.
Process Design Kit (PDK)
3DGS offers a custom design environment in AWR Microwave Office. Design kits are available which include parameterizable layouts (pcells) and device models for 3D electromagnetic simulations and schematic design. Substrate modeling capabilities are embedded within the PDK. There are two PDKs available: “LC-IPD” with high Q lumped elements for low frequency applications and “SIW” with distribute elements for mmWave applications.
Assembly Design Kit (ADK)
System-in-package (SiP) and advanced packaging designs can support multiple assembly options including flip chip, wirebond, and embedded die to 3DGS glass substrates. Moving in the vertical direction multiple glass layers can also be stacked on top of each other for 3D heterogeneous integration (3DHI). ADK will help to ensure predictable performance and manufacturability before tapeout.