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Manufacturing services
Customer designs are implemented at our secure manufacturing facility that offers flexibility of process flows and form factor to provide optimum cost/performance metrics to our customers
Wafer Processing
The 3DGS patented manufacturing process is simple, elegant and consistent with traditional semiconductor techniques. Photosensitive glass ceramic wafers similar in size to semiconductor silicon wafers are sourced from 3DGS glass supplier partners.
Panel Processing
3DGS is currently in planning stages for a 510mm x 515mm panel line using Photo Sensitive Glass (PSG) and other types of Glass material.
Engineering Services
3DGS offers design services for various RF subsystems at customers request