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UT’s Texas Institute for Electronics Awarded $840M to Build a DOD Microelectronics Manufacturing Center, Advance U.S. Semiconductor Industry

Washington, DC, June 17, 2024 -- Spectrum Control, a leading provider of miniature, modular, and intelligent RF components and solutions, today demonstrated a revolutionary reduction in the size of high-performance, anti-aliasing filters to complement its emerging class of Direct RF solutions. In cooperation with 3D Glass Solutions, Spectrum Control has developed a family of surface-mount, BGA devices from 500 MHz to 10 GHz with wafer-scale manufacturing on glass substrates. These new filters boast a physical size of only 2.6 x 5.4 mm.

ALBUQUERQUE, N.M.–(BUSINESS WIRE)–3D Glass Solutions Inc. (3DGS), a leading innovator of glass-based three-dimensional integrated passive solutions for radio frequency (RF), photonic and datacenters today announced the closing of a $30 million Series C financing. The round was led by Walden Catalyst Ventures, with participation from existing investors, including Intel Capital and Lockheed Martin Ventures, as well as new investments from Applied Ventures, LLC, Cambium Capital, and Mesh Cooperative Ventures.

Capability to address formation in semiconductor grade glasses such as HPFS and for applications including HPC (High Performing Computing, GPU/CPU packaging), MEMS, and Photonics.

Albuquerque, N.M. –(BUSINESS WIRE)–3D Glass Solutions Inc. (3DGS), a leading innovator of glass-based three-dimensional passive radio frequency (RF) devices, announced today it has raised an additional $4 million in an extended Series B1 funding round. 3DGS welcomed new investor Menlo Microsystems Inc., as well as follow-on investments from both Corning Incorporated (NYSE: GLW) and Sun Mountain Capital, bringing the total Series B1 raise to $24 million.

Albuquerque, N.M. – Nov. 30, 2021 – 3D Glass Solutions Inc. (3DGS), a leading innovator of glass-based three-dimensional passive radio frequency (RF) devices, today announced it has secured $20 million in Series B1 funding led by Intel Capital. CerraCap Ventures, Lockheed Martin Ventures and Nagase & Co. Ltd. were also in participation. This round of funding adds Intel Capital’s David Flanagan, Lockheed Martin’s Jeff Cunningham and Nagase’s Yoriyuki Yamashiro to 3DGS’ board of directors.

ALBUQUERQUE, N.M. — June 15, 2021 — 3D Glass Solutions, Inc. (3DGS), a leading innovator of glass-based, three-dimensional passive radio frequency (RF) devices, today introduced the industry’s first glass ceramic technology node for heterogeneous integration. The novel technology will support streamlined assembly integration and advanced packaging of commercial off the shelf components and custom integrated circuits, especially benefitting military and defense, advanced RF front end and system in package markets.

ATLANTA – INTERNATIONAL MICROWAVE SYMPOSIUM — June 8, 2021 — 3D Glass Solutions, Inc. (3DGS), a leading innovator of glass-based, three-dimensional passive radio frequency (RF) devices, today announced its newest process design kit (PDK) for Empty Substrate Integrated Waveguides (eSIW).

ATLANTA – INTERNATIONAL MICROWAVE SYMPOSIUM — June 8, 2021 — 3D Glass Solutions, Inc. (3DGS), a leading innovator of glass-based, three-dimensional passive radio frequency (RF) devices, today announced it has locked the process flow for its integrated passive device (IPD) technology node and solidified the IPD design rules in a process design kit (PDK) available for customer release.