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3DGS Signs License for Advanced TGV formation process from Corning

Capability to address formation in semiconductor grade glasses such as HPFS and for applications including HPC (High Performing Computing, GPU/CPU packaging), MEMS, and Photonics.

Data center Si Photonics

Data center Si Photnics

Key features include:

  • High volume manufacturing process

  • Targeting glasses with CTE matched to Silicon chips

  • Produce a variety of TGV sizes, aspect ratios, and patterns (custom production ready)

  • Tech Platform has ability to fully integrate RF and Digital components on single, heterogeneous solution

  • See image below

Through Glass Vias