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Markets
3DGS technology enables products that cover multiple markets that are both significant in market size and critical for safety and security of USA.
Wireless Communications
Maximize performance, cut power consumption, and increase system integration with high quality embedded passives, substrate integrated waveguides and multiple Redistribution Layers (RDL). 5G/6G Infrastructure, Filters and AiP/SiP modules in mobile handsets, automotive radar and IOT etc.
Aerospace & Defense
3DHI technology allows stacking of multiple glass layers. Flexible cavity formation in glass along with support for high temperature operation and RAD HARD features enable significant SWaP-C improvements for RF subsystems for aerospace and defense markets
Photonics
Thermal isolation and thermal stability to integrate lasers and Photonic chiplets on the same substrate along with photonic waveguides and Thru Light Vias (TLV) makes glass substrates ideal choice for Photonic modules and co-packaged optics
HPC/AI
Chiplet integration methodology demands large rigid substrates that can support very high interconnect density, bandwidth and performance to blur the difference between traditional on package and on chip interconnect. Glass is one of the few materials that can support these stringent requirements at a very reasonable cost
Sensors
Optical transparency, chemically inert nature of glass enables bio-sensors and quantum sensors to be built using glass substrates very efficiently