Technology Platform / Custom Fabrication / Micro-cavities

Micro-Cavities

Precise, micron-scale cavities can be created using 3DGS fabrication techniques with no chipping, fractures or breaks. Create cavities of any shape or size, with depths of up to 800 µm.

IMPROVE PERFORMANCE WITH REDUCED PACKAGE SIZE

Micro-cavities fabricated in APEX® Glass outperform traditional ultrasonic milling or standard wet-etching techniques, enabling customers to do more in a significantly smaller package.

A wide range of customers across multiple industries benefit from the APEX® Glass material properties or fabrication advantages over alternative materials: legacy glasses, silicon, and polymers.

WIDE VARIETY OF CAPABILITIES

Precise, micron-scaled, dimensional control for exact volumes
Straight sidewalls (<2 degrees) ensures efficient wafer scale production
Robust chemical and thermal compatibility
No edge chipping, fractures, or breaks; no sub-surface damage ensures high reliability
Cavities of any shape or size
Create cavities as deep as 800 microns
Integrate cavities with adjacent or in-cavity copper filled vias for electrical connections
Integrate cavities with sidewall angles of up to 45 degrees
Cavities with multiple shapes, sizes and depths can be integrated on the same chip
Create micro-cavities for wafer-level packages

END USER APPLICATIONS

    
        Cell phone sensors
        Lid/Base electronic packages
    
        Optoelectronics
        CCD image sensors
    
        Electronic connectors
        Mechanical spacers
    
        Ink jet printer heads
        Lab-on-a-chip

HIGHLY CUSTOMIZED PROCESS

Due to the high variety of applications and our ability to tailor our process to meet your needs, requirements are best discussed with our engineering staff. Let us help you by contacting us with the form below.