Technology Platforms / Custom Fabrication / Diode Sub-Mount

Diode Sub-mount

Laser submount edge wraps using precision 3DGS manufacturing techniques allow improved performance and reduced package size. Micron footprints, precision angles and integrated electrical connections are now possible.

IMPROVE PERFORMANCE AND REDUCE PACKAGE SIZE

High density arrays simplify integration, alignment, and assembly. High accuracy alignments reduce assembly errors and improve assembly costs.

HIGH-VOLUME MANUFACTURING

Wafer-level production ensures high-volume production with run-to-run repeatability.

PRECISION MANUFACTURING

3D Glass Solutions’ manufacturing process ensures the accurate manufacturing of edge wraps and alignment features with micro-scale precision every time!

ELECTRICAL AND OPTICAL INTEGRATION

Electrical traces can be combined with thru-holes or edge wraps to maximize integration possibilities further reducing package sizes.

CUSTOM SOLUTIONS FOR IMPROVED OUTCOMES

Each application is unique in footprint, thermal management requirements, and additional features. Contact us directly with your specific needs.

DESIGN LIMITS

    
        PARAMETERS
        TYPICAL
        PERFORMANCE LIMITS
    

        SIZE
        0.75mm x 0.75mm
        0.25mm x 0.35mm
    

        HEIGHT
        0.35mm
        0.10mm
    

        ANGULAR TOLERANCES
        70 – 110° (+/- 1.5°)
        70 – 110° (+/- 1.0°)
    

        PAD WIDTH
        100 – 500 microns
        75 – 500 microns
    

        SPACING BETWEEN PADS
        100 microns
        75 microns
    

        THERMAL CAPACITY
        1 W / mK
        50 W / mK
    

        ASSEMBLY OPTIONS
        Solder, Wire bond
        Solder, Wire bond
    