RF SIP (System in Package)

Solution Overview

Glass-based RF SiP interposers allow you to offer significant product differentiation. Our proprietary APEX® Glass allows you to realize high-value system integration in the most compact footprint enabling you to meet even the most demanding product definitions for next generation RF and wireless products.

At the heart of our interposer technology is the ability to manufacture precise through glass vias (TGVs, 50 microns in diameter) for I/Os with tight metal redistribution line and spacing (<30 microns) with micron-scale precision.  Additionally, the in-glass manufacturing of integrated passive devices (e.g. inductors & capacitors) enable advanced RF performance.

Key Benefits

• Heterogeneous integration (HI), enabling the packaging of digital IC, analog IC, RF IC, and MEMS into a common package

• Reduce chip size by 70% compared to PCBs

• Up to 20% reduction in power utility

• More than a 50% increase in wireless bandwidth

• Wideband applications ranging from DC to 100 GHz

• Embed passive devices (e.g. inductors, capacitors, baluns, antennas, etc.) into the package

• Lower cost of ownership by minimizing assembly costs

• Reduce time to market