Minimize unwanted RF parasitics by the seamless integration of high-Q inductors (Q > 75) to maximize Q.
0201 and 0402 designs
200 to 300 microns thick
Micro-scale manufacturing precision leads to ultra-tight quality factor and inductance distribution
Standard or Custom Footprints
01005 or larger standard and custom designs
|Size Code||0201, 0402|
|Inductance||0.5 nH to 10.0 nH
0.2 nH increments
(based on temp rise)
|SRF (min)||21 GHz (1.3 nH)|
|Operating Temp Range||-55°C to 125°C|
Embedded inductance devices have been qualified through a variety of JEDEC and IPC testing standards, including vibration, shock, thermocycling, and moisture.
HIGH Q AND LOW LOSS SMD INDUCTORS
Standard or custom inductors demonstrate superior Q factors in ultra-small footprints. 0402 and 0201 standard inductors are available for sampling; 01005 are in development.
3DGS SMD Inductors are specifically built to IPC surface mount standards for easy integration into existing inductor footprints. Standard solder techniques are used for assembly.
Lithographic reproduction processes facilitate mass production of devices with superior batch-to-batch consistency.
HIGH SRF MEANS HIGH FREQUENCY USE
3DGS has specifically designed our inductor library for >3 GHz applications. Our products have been shown to improve performance in next generation LTE and 5G products.
Custom discrete inductor and capacitor components fabricated in our proprietary APEX® Glass offer the highest Quality factors (High Q) in the smallest form-factor. 3D Glass Solutions offers a wide variety of inductive and capacitive devices that cover a broad array of power handling and frequency capabilities targeted specifically for the RF community.
GLASS CORE INDUCTOR AND PERFORMANCE CHAR
Sample inductor shown below has a 1005 footprint and is a 7 turn inductor with 90µm wide turns.
Graph shown below shows a range of inductor performance from 1 to 100nH.
GLASS CORE INDUCTOR FEATURES TABLE
|Quality Factor||Measured 98 @ 1.8 GHz, 2.7nH|
|Inductance Range||0.5 - 200nH|
|Footprint||0201 or larger|
|Current Handling||> 0.5 Amps|
|Connection Type||SMT, flip-chip, wire bonding|