RF Discrete Components
3DGS utilizes the unique electrical and physical properties of glass ceramics to make high-frequency passive devices for the GHz frequency range. Implementing standard semiconductor manufacturing methods, 3DGS is able to design three-dimensional components with wet etching in dilute acids to create 3D microstructures within glass substrates, using air as a dielectric, to produce High-Q devices with low cross-talk and parasitic losses. The integration of air as the dialectic constant (Dk) limits loss from crossover and improves performance across the spectrum from 1 to 300 GHz. 3DGS designs are delivering superior performance with less leakage, better signal integrity, and longer battery life.