RF Bridges

IMPROVE PERFORMANCE AND REDUCE FOOTPRINT

Precisely match impedance values with reduced footprints and heights.

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CUSTOM RF BRIDGES

RF bridges are incorporated to improve circuit-to-circuit electrical connections by utilizing an impedance-matched RF bridge chip with uniform wire bond lengths. These RF bridges are custom designed to meet customer-specific bridging requirements for chip integration and height.

GROUNDED CO-PLANAR WAVEGUIDE DESIGN

3DGS RF bridges utilize low-loss glass substrates with TGVs which allow RF waveguides to have grounding along both sides and below the transmission line for highest performance.

Top wire pads are compatible with wire bonding.

HIGHLY SCALABLE

Lithographic reproduction processes facilitate mass production of devices with superior batch-to-batch consistency.

 

 

SPECIFICATIONS

Parameters

Typical Performance

Impedance Values

25 Ω to 100 Ω

Thickness

90 μm to 800 μm

Attenuation (dB)

As low as 0.3 dB/cm at 30 GHz

Size

As small as 0.5 mm x 0.5 mm

Operating Temperature

SMT -55°C to +155°C

Compliance

RoHS