Fiber Aligners

Improve and Simplify Integration

High-density arrays simplify integration, alignment, and assembly, speeding up manufacturing and reducing BOM.

ELECTRICAL AND OPTICAL INTEGRATION

Electrical traces can be combined with thru-holes to maximize integration possibilities and further reducing package sizes.

CUSTOM SOLUTIONS FOR IMPROVED OUTCOMES

Each application is unique in footprint, thermal management requirements, and additional features. Contact us directly with your specific needs.

DESIGN LIMITS

Parameters Typical Performance Limits
Size  > 1mm x 1mm  < 1mm x 1mm
Height 1 – 5mm 0.25 – 10mm
Fiber Diameters 80 – 250 microns 80 – 250 microns
Center-to-Center Accuracy 100nm 50nm
Diameter Accuracy +/- 1.5 microns  +/- 1.0 microns