President and CEO
Jeb H. Flemming
Chief Technology Officer & Founder
VP of Partnerships
Babu is an accomplished semiconductor industry executive with over 38 years of experience in the field. Babu held the position of Senior Vice President and General Manager of the IP Group at Cadence Design Systems from 2017 to 2021. Babu was the co-founder and CEO of Beceem Communications, Inc., which was acquired by Broadcom in 2010. At Broadcom, he served as VP of Engineering where he led the team that developed Broadcom’s first LTE multi-mode baseband chipset. Prior to Beceem, Babu was co-founder of Centillium Communications, Inc., where he served in engineering and general manager roles of increasing responsibility, and successfully led it to an IPO, reaching a ~$3B peak market cap. Babu holds a Master of Technology degree in Electrical Engineering and Computer Science from the Indian Institute of Technology in Kanpur.
Chief technology architect and lead engineer, Jeb directs the technical team at 3DGS and interfaces with strategic partners and customers to optimize device designs for manufacture. Before founding 3DGS and while at Sandia National Laboratories, Jeb was the principal developer of the innovative micropost technology, which won a 2007 R&D 100 award. He has been the inventor or co-inventor on more than 30 patent applications and has led the development work associated with 3DGS’s novel substrates and applications. In addition to BS and MS degrees in Chemical Engineering, Jeb also holds an MBA from the University of New Mexico’s Anderson School of Management.
Adam brings over 20 years of financial leadership to the 3DGS team and is responsible for managing the Company’s financial planning, accounting, treasury, contract review, and human resources functions. His past professional roles included CFO, VP Finance, and Controller positions at EMCORE Corporation, an international high-tech public semiconductor manufacturer. Adam has a strong technical background in US GAAP accounting and extensive experience in SEC reporting, SOX compliance and internal controls, IPO and M&A transactions, and private / public debt and equity financing. Prior to EMCORE, he was a 5-yr certified public accountant with PricewaterhouseCoopers, LLP. He has a bachelor’s degree in Finance from the Pennsylvania State University and is a member of the American Institute of Certified Public Accountants.
Tim is the Director of Engineering responsible for the engineering and manufacturing of all 3DGS products. Tim brings over 25 years of technical problem-solving experience in mechanical, electrical, chemical, materials, industrial and manufacturing engineering while at Intel Corporation. During his tenure at 3DGS, he has enhanced the technical capability at all levels of the company. Results include improving yield, generating intellectual property, developing patent based process improvements, reducing cycle time and increasing purchase order closure rates. Tim has a Bachelor of Science degree in material science engineering from the University of Illinois Urbana-Champaign.
Bob has over 37 years semiconductor industry general management and business development. He was co-founder and CEO of Sarda Technologies and Symmorphix and VP at Cirrus Logic, X-Celeprint, Semprius and Nextreme Thermal Solutions. His Fortune 500 company experience includes marketing leadership at Applied Materials and Intel as well as field engineering at General Electric. Bob holds an MBA from University of Chicago and BSME from Duke University.
Board of Directors