CEO & President
Jeb H. Flemming
Chief Technology Officer & Founder
Director of Operations
With over 25 years of senior management experience in the electronics sector, Mark Popovich has held executive positions at Henkel AG & CO. KGaA, and Amkor Technology Inc., and was one of the founding members of semiconductor start-up, ChipPAC, Inc. He also serves as a member of the Board of Directors of Intevac Corporation (NASDAQ: IVAC). Mark earned a BS degree in Ceramic Science and Engineering from The Pennsylvania State University and holds four electronic packaging-related patents as an inventor or co-inventor.
Chief technology architect and lead engineer, Jeb directs the technical team at 3DGS and interfaces with strategic partners and customers to optimize device designs for manufacture. Before founding 3DGS and while at Sandia National Laboratories, Jeb was the principal developer of the innovative micropost technology, which won a 2007 R&D 100 award. He has been the inventor or co-inventor on more than 30 patent applications and has led the development work associated with 3DGS’s novel substrates and applications. In addition to BS and MS degrees in Chemical Engineering, Jeb also holds an MBA from the University of New Mexico’s Anderson School of Management.
Adam brings over 20 years of financial leadership to the 3DGS team and is responsible for managing the Company’s financial planning, accounting, treasury, contract review, and human resources functions. His past professional roles included CFO, VP Finance, and Controller positions at EMCORE Corporation, an international high-tech public semiconductor manufacturer. Adam has a strong technical background in US GAAP accounting and extensive experience in SEC reporting, SOX compliance and internal controls, IPO and M&A transactions, and private / public debt and equity financing. Prior to EMCORE, he was a 5-yr certified public accountant with PricewaterhouseCoopers, LLP. He has a bachelor’s degree in Finance from the Pennsylvania State University and is a member of the American Institute of Certified Public Accountants.
With over 25 years in technical leadership, Rick Vitale has held Operations Management positions in the electronics industry spanning global aerospace, defense and commercial component businesses. Rick specializes in establishing and growing organizations in operational excellence with a focus on ramping NPI, developing and leading process engineering, quality, and continuous improvement teams. Rick’s most recent experience is with Materion Corporation where he led a restructuring of the manufacturing operation into the top performing division for the company. Rick’s professional history includes: Honeywell International, Optical Air Data Systems, Emcore, and CTS (formerly Motorola RF) corporations where he led the development and manufacture of various types of electronics, electro-mechanical devices, and advanced material applications. He also worked internationally in Mexico as a factory operations director. Rick is a certified Six Sigma/Lean Blackbelt and holds a BS in Electrical and Electronics Engineering and a MS in Engineering Management from The University of South Florida.
Tim is the Engineering Manager responsible for the manufacture of all 3DGS products. Tim brings over 25 years of technical problem-solving experience in mechanical, electrical, chemical, materials, industrial and manufacturing engineering while at Intel Corporation. During his tenure at 3DGS, he has enhanced the technical capability at all levels of the company. Results include improving yield, generating intellectual property, developing patent based process improvements, reducing cycle time and increasing purchase order closure rates. Tim has a B.S. in material science engineering from the University of Illinois Urbana-Champaign.